The Suede type series from Fujibo
categorize themselves as final polishing pads.
These pads main application are for wafer polishing.
POLYPAS #191 is used for low-pressure polishing and
is suitable for the final polishing stage of silicon, GaAs, and InP wafers,
as well as texturing Ni-P plated hard disks. The nap layer is significantly
soft and consists of fine pores. This pad has excellent resistance to
acid and alkaline.
POLYPAS #194 utilizes a nap layer that consists of large,
rigid pores that are ideal for low- to medium- pressure polishing. This
pad is also used for the first and second stages of silicon, GaAs, and
InP wafer polishing as well as rough polishing of Ni-P plated hard disks.
POLYPAS #210 is made of the most durable polishing material
and performs well when used in conjunction with chemicals. Due to the
small pore size, this pad is effective in various polishing applications
that involve silicon wafers, glass, Ni-P plated hard disks, and stainless
steel. It also provides long life.
POLYPAS #210 (NB) - With a very durable micro-porous
inner layer, this pad's absorbency ensures a perfect surface finish. To
ensure excellent micro waviness and flatness, this pad is available in
several base materials: non-woven cloth, soft PVC, and PET.
POLYPAS #250 is designed for ultra-fine polishing of
silicon wafers, glass, and Ni-P plated hard disks. This pad has a much
softer nap layer and finer pores than POLYPAS #210, and works well with
POLYPAS #27, designed for extensive use in low to medium
pressure polishing, is the best pad for the final polishing stage of silicon
and GaAs wafers. This pad is also the best choice for texturing Ni-P plated
hard disks because it has the softest nap layer, high compressibility,
and high elasticity.
POLYPAS #7000 - By improving the inner foam layer, Fujibo
has successfully engineered this multi-purpose, high-quality pad. It has
a durable, even surface that guarantees high performance results. The
nap hardness can be adjusted to meet your requirements.